Kev cuam tshuam ntawm kev txo tus nqi miscontrol on grain tsis muaj-uniformity tsis muaj kev sib luag thiab cua sov dissipation tsis xws luag rau VR / AR Micro Riam Dej Sov

1. Lub hauv paus rau phau ntawv: Daim ntawv thov yam ntxwv ntawm Aluminium Ntawv Nyiaj rau Micro Heat Sinks nyob rau hauv VR / AR Devices thiab qhov tseem ceeb ntawm kev txo tus nqi tswj

Aluminium ntawv nyiaj rau micro cua sov dab dej hauv VR / AR li (feem ntau 1235/8079 lamOs, 6.35μm tuab) ua hauj lwm raws li cov tub ntxhais kub dissipation tivthaiv nyob rau hauv VR / AR headsets, cov tswj, thiab cov khoom siv zoo sib xws. Vim muaj qhov txwv sab hauv ntawm cov khoom siv no (E.G., Thaum tshav kub kub dissipation kab noj hniav ntim ≤15cm³ hauv VR headsets), Cov dab dej kub yuav tsum yog miniaturized (loj 3-15mm) nrog cov thermal conductivity kom tsis txhob muaj cua sov hauv zos - tshwj xeeb tshaj yog txij li lub zog hluav taws xob ntawm 5-15W, Yuav tsum muaj qhov sib txawv ntawm qhov kub thiab txias ≤ 3 ℃.

Thaum lub sij hawm dov txheej txheem, tus nqi txo (tag nrho tus nqi txo = [(pib thickness – zaum kawg thickness)/pib thickness]× 100%; single-pass txo tus nqi = [(pib thickness ntawm hla – zaum kawg thickness ntawm hla)/pib thickness ntawm hla]× 100%) yog ib qho tseem ceeb parameter regulating grain evolution. Raws li 2024 VR/AR cov ntaub ntawv kev lag luam, 42% ntawm cov cuab yeej hluav taws xob dissipation tsis ua haujlwm tshwm sim los ntawm “Local overheating ntawm micro cua sov dab dej,” uas tuaj yeem taug qab mus rau qhov tsis raug txo tus nqi tswj ntawm aluminium ntawv ci rau micro heat sinks hauv VR/AR li: ① Tsis txaus txo tus nqi ua rau cov nplej tsis sib xws, ua rau 7W /(kil k · k) Qhov sib txawv hauv zos thermal conductivity ntawm lub dab dej kub; ② Kev hloov pauv ntau dhau ntawm kev txo qis ib zaug ua ib qho “hmoov nplej / coarse-grain” gradient, tsim tshav kub dissipation tuag aav (kub txawv >5℃); ③ Tsis sib npaug transverse txo tus nqi ua rau ntug overheating, txo cov kev pab cuam lub neej ntawm VR / AR ntaus ntawv chips los ntawm 20%.

Txhawm rau daws cov teeb meem no, nws yog thawj zaug uas yuav tsum tau qhia meej txog kev sib raug zoo ntawm tus nqi txo, grain qauv, thiab thermal conductivity - tso lub hauv paus theoretical rau kev dov ntawm hom ntawv txhuas no.

2. Theoretical kev sib raug zoo ntawm tus nqi txo, Grain Structure, thiab Thermal Conductivity rau Aluminium Ntawv Nyiaj hauv VR / AR Micro Heat Sinks

(1) Core Mechanism of Grain Regulation by Reduction Rate: Kho kom haum rau qhov yuav tsum tau ua kom sov me me

Lub dov ntawm aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li koom nrog “multi-pass txias dov” (8-12 hla, txo thickness ntawm 2 hli mus rau 6.35μm, nrog tus nqi txo tag nrho ≈99.68%). Tus nqi txo cuam tshuam rau dynamic recrystallization (DRX) dhau “deformation cia lub zog,” uas nyob rau hauv lem txiav txim siab grain haum rau tshav kub dissipation:

1. Deformation Cia Zog thiab Recrystallization: Lub zog tseem ceeb khaws cia rau DRX ntawm cov ntawv txhuas no (1235 hlau alloy) yog 75J/m³. Ib leeg-pass txo tus nqi ntawm 20%-25% generates cia zog ntawm 80-110J/m³, tsim equiaxed nplej ntawm 5-7μm - zoo tagnrho rau kev ua kom cov thermal conductivity nyob rau hauv micro cua sov dab dej;

2. Grain Orientation thiab Thermal Conductivity: Tus nqi txo qis (22%-24% rau pass) txhawb nqa {111} kev ntxhib los mos rau account rau >60% (thermal conductivity 12% siab dua random kev ntxhib los mos). Nyob rau hauv sib piv, txo qis tus nqi (>30%) nce qhov {100} kev ntxhib los mos proportions rau 18%, txo thermal conductivity los ntawm 5% - ua tsis tau raws li cov cua kub dissipation precision yuav tsum tau ntawm VR / AR li.

(2) Quantitative Model of Grain Structure thiab Thermal Conductivity: Hais txog qhov tshwj xeeb ntawm Micro Heat Sinks

Vim qhov me me thiab kub kub flux ceev (10-20W / cm²) ntawm VR / AR micro cua sov dab dej, yuav tsum muaj kev sib raug zoo ntawm grain-thermal conductivity. Muab los ntawm hlau thermal conduction txoj kev xav, tus qauv yog:

λ = λ₀ × [1 – k ×(6/d)]

• λ ₀: Thermal conductivity ntawm ib leeg-crystal aluminium (237W /(kil k · k) ntawm 25 ℃);

• k: Grain boundary scattering coefficient (0.12 rau hom ntawv txhuas no);

• d: Cov qoob loo loj (μm; micro heat sinks xav tau d = 5-7μm nrog tus qauv sib txawv ≤2μm).

Thaum d nce ntawm 5μm mus rau 15μm, λ nce los ntawm 225W /(kil k · k) rau 232W /(kil k · k), Qhov sib txawv ntawm 7W /(kil k · k). Rau micro cua sov dab dej, Qhov sib txawv no ua rau qhov sib txawv ntawm qhov kub thiab txias tshaj 4 ℃ - deb tshaj qhov ≤ 3 ℃ txwv rau VR / AR cov khoom siv - ua rau cov cua sov dissipation tuag aav..

3. Peb qhov xwm txheej ntawm qhov tsis sib xws ntawm cov qoob loo uas tshwm sim los ntawm kev tswj tus nqi txo qis (Hloov mus rau VR / AR Cov Kev Xav Tau Thaum Tshav Kub Dissipation)

Txhawm rau kom muaj nuj nqis ntawm qhov cuam tshuam ntawm kev txo qis tus nqi tswj ntawm cov nplej uniformity thiab kub dissipation, Lub rooj 1 Cov ntsiab lus tseem ceeb ntawm txhua qhov tsis ua haujlwm scenario, ncaj qha txuas cov txheej txheem tsis xws luag rau cov teeb meem kev ua haujlwm ntawm cov cuab yeej:

Lub rooj 1: Grain Structure thiab Heat Dissipation Parameters Nyob rau hauv qhov tsis zoo txo ​​tus nqi Scenarios

(1) Tsis txaus Tus Nqi Txo Tag Nrho (<50% hauv Critical Passes): Recrystallization tsis txaus thiab lub zos overheating ntawm cov dab dej kub

1. Cov yam ntxwv txheej txheem: Rau aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li, tus nqi txo tag nrho hauv cov 3 hla dhau ua ntej ua tiav dov (Thickness ntawm 50μm → 25μm → 12μm) yuav tsum yog ≥50%. Yog txo kom 40% (50μm → 30μm), lub zog khaws cia poob rau 65J / m³-hauv qab tus nqi tseem ceeb rau DRX;

2. Kev cuam tshuam rau cov qauv nplej thiab cov cua sov dissipation: Raws li qhia hauv Table 1, Qhov no scenario tsim ib qho kev faib tawm bimodal. Qhov sib thooj λ qhov sib txawv hauv micro cua sov dab dej nce mus txog 8W /(kil k · k), ua rau 10 ℃ hauv cheeb tsam kub sib txawv hauv VR / AR headset chips thiab ua rau cov thav duab poob - cuam tshuam ncaj qha rau cov neeg siv kev paub.

(2) Kev hloov pauv ntau dhau nyob rau hauv Ib-Pass Txo Tus Nqi (Deviation >8%): Gradient thiab Heat Dissipation Dead Zones

1. Cov yam ntxwv txheej txheem: Qhov kev txo qis ib zaug hauv lub 2 dhau ua ntej qhov kawg dov (25μm → 12μm → 6.35μm) yuav tsum ruaj khov ntawm 45%-50%. Cov menyuam hnav tuaj yeem ua rau muaj kev hloov pauv 38%-48% (10% kev sib txawv);

2. Kev cuam tshuam rau cov qauv nplej thiab cov cua sov dissipation: Tshuav, qhov fluctuation no tsim alternating “txias / kub strips” raws li kev taw qhia dov. Raws li Rooj 1 qhia, Qhov sib txawv thermal conductivity nce mus txog 8W /(kil k · k), thiab qhov kub ntawm qhov sib txawv tshaj 10 ℃ - deb tshaj li VR / AR ntaus ntawv txwv - tsim irreversible heat dissipation tuag aav.

(3) Tsis sib npaug Transverse txo tus nqi (Ntug-Center Deviation >5%): Ntug Overheating thiab txo cov cuab yeej kev ntseeg tau

1. Cov yam ntxwv txheej txheem: Abnormal roller crown (0.02hli → 0.04mm) vim a 6% transverse txo tus nqi sib txawv (48% ntawm qhov chaw, 42% ntawm ntug);

2. Kev cuam tshuam rau cov qauv nplej thiab cov cua sov dissipation: Tshaj li cov xwm txheej saum toj no, transverse unevenness feem ntau cuam tshuam cov cuab yeej siv tau ntev. Lub rooj 1 qhia tau hais tias ntug kub yog 7 ℃ siab tshaj qhov chaw, accelerating sealing roj hmab aging thiab nce tus nqi tsis ua hauj lwm los ntawm 1.5% mus rau 4.8% - tus nqi tseem ceeb rau cov neeg tsim khoom.

4. Kev pov thawj ntawm VR / AR Device Heat Dissipation Failures Ua los ntawm Cov Txheej Txheem Tsis Zoo

Tsim los ntawm kev txheeb xyuas scenario, ob qho tib si kev sim thiab kev tshawb fawb txog kev lag luam tau ua los ua pov thawj qhov kev cuam tshuam ntawm cov nplej tsis sib xws. Lub rooj 2 nthuav qhia cov ntaub ntawv kuaj xyuas kom ntxaws, thaum cov xwm txheej tiag tiag hauv ntiaj teb ntxiv lees paub qhov kev tshawb pom.

Lub rooj 2: Laboratory Verification Cov txiaj ntsig ntawm Micro Heat Sink Performance

(1) Laboratory Verification (Sib piv Micro Heat Sink Scenario)

1. Qauv npaj: Xaiv aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li nrog “fluctuating single-pass txo tus nqi” (zoo-grain zone d = 5μm, coarse-grain cheeb tsam d = 14μm) thiab fabricate 10mm × 5mm × 6.35μm micro cua sov dab dej;

2. Kev kuaj: Raws li Rooj 2 qhia, Siv cov cua kub ntawm 15W / cm² (simulating VR nti thaum tshav kub kub tiam) Qhia tawm qhov sib txawv ntawm 11 ℃ - deb tshaj qhov ≤ 3 ℃. Laser flash tsom xam (NETZSCH LFA 467) paub tseeb tias qhov sib txawv thermal conductivity ntawm 8W /(kil k · k);

3. Xaus: Thaum tshav kub kub dissipation tuag aav tshwm sim los ntawm qhov tsis sib xws grain qauv thawb VR ntaus ntawv nti kub siab tshaj qhov pib (60℃), triggering zaus txo kev tiv thaiv.

(2) Industrial Case: Failure Analysis ntawm VR Device Manufacturer

Hauv 2023, VR headset manufacturers siv aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li nrog “tsis sib npaug transverse txo tus nqi,” ua rau:

• Raws li tau tshwm sim hauv Table 2, ntug kub ntawm lub dab dej kub mus txog 58 ℃ (vs. 51℃ ntawm qhov chaw), ua rau cov nti zaus txo qis (ncej tus nqi poob los ntawm 90Hz mus rau 75Hz);

• Cov neeg siv tsis txaus siab tus nqi nce los ntawm 2.3% rau 8.5%, nrog ib tus nqi tom qab muag ntau tshaj 5 lab yuan;

• Tom qab hloov cov ntawv ci nrog optimized txo tus nqi (raws li qhia nyob rau hauv kab thib peb ntawm Table 2), Qhov kub dissipation kub qhov sib txawv poob mus rau 2.5 ℃, thiab tus nqi tsis txaus siab poob rov qab rau 1.2%.

5. Precision Reduction Rate Control Strategies rau Aluminium Ntawv Nyiaj hauv VR / AR Micro Heat Sinks

Raws li kev txheeb xyuas cov txiaj ntsig, Lub hom phiaj tswj cov tswv yim tau tsim los daws txhua qhov kev ua tsis tiav. Lub hauv paus yog nyob rau hauv staged txo tus nqi tsim, ruaj khov single-pass tswj, thiab tsis sib xws transverse faib-nrog cov ntsiab lus tseem ceeb tau piav qhia hauv Table 3.

Lub rooj 3: Staged Reduction Rate Design rau 6.35μm 1235 Aluminium Ntawv Nyiaj (Pib Thickness 2 hli)

(1) Staged Total Reduction Rate Design: Kev Kho Kom Zoo Rau Cov Nroj Nroj Tsuag rau Micro Heat Dissipation

Raws li Rooj 3 ua piv txwv, qhov kawg dov theem (hla 7-8) Nws yog ib qho tseem ceeb - tuav tus nqi txo tag nrho ≥50% ua kom lub zog deformation tau nce mus txog 90-110J / m³. Qhov no ua rau DRX txaus, ua rau grain loj ntawm 5-7μm nrog tus qauv sib txawv ≤2μm - zoo kawg nkaus txuam cov thermal conductivity xav tau ntawm VR / AR micro cua sov dab dej.

(2) Stable Single-Pass Txo Tus Nqi Tswj: Tiv thaiv VR / AR Thaum tshav kub kub Dissipation Dead Zones

1. Cov menyuam saib xyuas: Siv lub laser profileometer rau lub sijhawm hnav kom pom tseeb (Qhov tseeb 0.001mm). Tsis siv neeg hloov rollers thaum hnav tshaj 0.02mm, txo qhov hloov pauv ntawm ± 8% mus rau ± 3% - ib kauj ruam tseem ceeb kom tsis txhob muaj “hmoov nplej / coarse-grain” gradient hauv Table 1;

2. Kev sib haum xeeb: Ua kom ruaj khov ua tiav dov nro ntawm 15-18kN (Kev hloov pauv ≤ ± 1kN). Txhawb rau kev sib txawv los ntawm kev kho dov ceev (100-120m / kuv), txwv kev hloov pauv ib zaug mus rau ≤5%;

3. Cov lus qhia online: Siv X-ray thickness ntsuas (qhov tseeb 0.1μm) khaws cov ntaub ntawv txhua 10ms. Kho lub siab ntawm lub tog raj kheej txo (Qhov tseeb 0.01MPa) thaum thickness sib txawv tshaj 0.3μm - kom ntseeg tau tias sib xws nrog tus nqi ib zaug hauv cov lus 3.

(3) Uniform Transverse txo tus nqi: Tsis txhob Edge Overheating

1. CVC Roller Crown: Kho cov yas rau 0.015-0.02mm raws li qhov dav ntawm lub dab dej kub (3-15mm), limiting transverse siab sib txawv mus rau ≤3% - hais txog qhov teeb meem ntawm ntug-center hauv Table 1;

2. Ntug cua sov: Nruab ib qho ntug cua sov ntaus ntawv (50-60℃) ntawm lub dov zeb inlet kom txo cov ntug deformation kuj, qis ntug-center deviation los ntawm >5% ≤ 3%;

3. Noob Saib Xyuas: Kev koom ua ke hauv online EBSD system los sau cov ntaub ntawv los ntawm 3 transverse seem ib meter ntawm ntawv ci. Kho cov menyuam yas thaum qhov sib txawv ntawm qhov sib txawv ntau tshaj 15% - kom ntseeg tau tias qhov sib txawv ntawm qhov sib txawv tau pom hauv cov qauv zoo ntawm lub Rooj 2.

6. Cov lus xaus thiab Outlook

Tsis tsim nyog txo tus nqi tswj ntawm aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li ua rau cov kab mob sib kis ntawm “khaws cia zog → nplej qauv → thermal conductivity,” tsim tshav kub dissipation tuag aav (Qhov kub siab tshaj qhov sib txawv 11 ℃) thiab cuam tshuam cov cuab yeej stability. Raws li pom los ntawm Tables 1-3, kev ua “tag nrho tag nrho cov dov txo tus nqi ≥50%, Kev hloov pauv ib zaug ≤ ± 5%, Kev sib txawv ntawm qhov sib txawv ≤ 3%” ua tiav qhov ntau thiab tsawg ntawm 5-7μm (tus qauv sib txawv ≤2μm) thiab thermal conductivity sib txawv ≤3W /(kil k · k)-ua tau raws li ≤3 ℃ kub dissipation yuav tsum tau rau VR / AR li.

Cov lus qhia kev txhim kho yav tom ntej tsom mus rau ob thaj chaw: ① Tsim ib qho “AI txo tus nqi kwv yees qhov system” los hais txog qhov sib txawv ntawm VR / AR cov khoom siv hluav taws xob ntau dua (chip zog ncav cuag 20W los ntawm 2025), enabling proactive deviation kho; ② Muab cov mem tes tam sim no-pab dov kom txo tau qhov sib txawv ntawm cov nplej, nce qib no ntawm aluminium ntawv ci mus rau “xoom tshav kub dissipation tuag aav.”

Lub ntsiab cai: Txo tus nqi tswj rau aluminium ntawv ci rau micro cua sov dab dej hauv VR / AR li yuav tsum ua qhov tseem ceeb “grain uniformity yoog rau me me tshav kub dissipation.” Tsuas yog thaum cov kev ntsuas tau raug sib raug zoo rau cov kev xav tau ntawm cov khoom siv hluav taws xob - raws li pom hauv cov ntaub ntawv los ntawm Cov Lus 1-3 - tuaj yeem ua haujlwm ntev ntev ntawm VR / AR cov cuab yeej tau lees paub.