Impembelelo yokuNcitshiswa kweMigangatho yokuNcitshiswa kweNtlawulo yeRhasi yokuNgeretha kunye ne-Fefippy Geripation kwi-6.35μm ye-Aluminium foil ye-vr / i-varick micro yokutshisa i-vr / i-war micro yokutshisa i-vr

1. Intshayelelo: Iimpawu zeSicelo se-Aluminiyam yeFoil ye-Micro Heat Sinks kwi-VR / AR Devices kunye nokubaluleka koLawulo lokuNcitshiswa

Ifoyile yeAluminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR (kuqala 1235/8079 izabelo, 6.35μm ubukhulu) isebenza njengeyona nxalenye yokuphelisa ubushushu kwii-headset zeVR/AR, abalawuli, kunye nezixhobo ezifanayo. Ngenxa yokunqongophala kwendawo yangaphakathi yezixhobo ezinjalo (I-E.G., umthamo wokukhutshwa kobushushu ≤15cm³ kwiiseti zentloko zeVR), iisinki zobushushu kufuneka zenziwe zincinci (ubukhulu 3-15mm) kunye ne-thermal conductivity efanayo ukunqanda ukushisa kwendawo-ingakumbi kuba amandla obushushu be-chip asuka kwi-5-15W, ifuna umahluko wobushushu bendawo ≤3℃.

Ngexesha lenkqubo yokuqengqeleka, izinga lokunciphisa (ireyithi yokunciphisa iyonke = [(ubukhulu bokuqala – ubukhulu bokugqibela)/ubukhulu bokuqala]×100%; ireyithi yokunciphisa ipasi enye = [(ubukhulu bokuqala bepasi – ubukhulu bokugqibela bepasi)/ubukhulu bokuqala bepasi]×100%) yiparameter engundoqo elawula ukuvela kweenkozo. Ngoku ka 2024 Idatha yoshishino yeVR/AR, 42% yokusilela ukutshatyalaliswa kobushushu kwisixhobo kuvela “ukufudumeza kwendawo yobushushu obuncinci bokutshisa,” enokuthi ilandelelwe kulawulo olungafanelekanga lokunciphisa izinga ifoyile yealuminiyam kwiisinki zobushushu ezincinci kwizixhobo zeVR/AR: ① Ukungonelanga kweqondo lokucutha okubangela ukungalingani kobungakanani beenkozo, ikhokelela kwi7W/(m · k) Umahluko kwi-thermal conductivity yendawo ye-heat sink; ② Ukuguquguquka okugqithisileyo kwireyithi yokunciphisa ipasi enye kudala a “iinkozo ezicolekileyo/ezirhabaxa” ukuthambeka, ukwenza iindawo ezifileyo zokuchitha ubushushu (umahluko lobushushu >5℃); ③ Umlinganiselo wokunciphisa ongalinganiyo onqamlezileyo uphumela kubushushu obugqithisileyo, ukunciphisa ubomi benkonzo ye-VR/AR isixhobo chips nge 20%.

Ukujongana nale mingeni, okokuqala kuyimfuneko ukucacisa ubudlelwane phakathi kwezinga lokunciphisa, ulwakhiwo lweenkozo, kunye ne-thermal conductivity-ukubeka isiseko sethiyori sokuqengqeleka ngokuchanekileyo kolu hlobo lwefoyile ye-aluminium.

2. Ubudlelwane bethiyori phakathi kwereyithi yokuNcitshiswa, Ulwakhiwo lweenkozo, kunye neThermal Conductivity yeFoil yeAluminiyam kwiVR/AR Micro Heat Sinks

(1) Indlela enguNdoqo yoLawulo lweeNkozo ngeReyithi yokuNcitshiswa: Ukuziqhelanisa neeMfuno zoKuchitha ubushushu obuncinci

Ukuqengqeleka kwe ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR ibandakanya “multi-pass kubanda rolling” (8-12 uyapasa, ukunciphisa ubukhulu ukusuka kwi-2mm ukuya kwi-6.35μm, ngezinga lokuthotywa lilonke ≈99.68%). Izinga lokunciphisa lichaphazela i-recrystallization enamandla (DRX) nge “deformation amandla agciniweyo,” nto leyo emisela ukufaneleka kweenkozo ekuchitheni ubushushu:

1. I-Deformation egciniweyo yamandla kunye ne-Recrystallization: Amandla abalulekileyo agcinwe kwi-DRX yale foil ye-aluminium (1235 ingxubevange) yi 75J/m³. Umyinge wokucuthwa kokupasa omnye we 20%-25% yenza amandla agciniweyo e-80-110J/m³, ukwenza iinkozo ezilinganayo ze-5-7μm-zilungele ukuqinisekiswa kwe-thermal conductivity efanayo kwiindawo zokutshisa ubushushu obuncinci.;

2. Ukuqhelaniswa neeNkozo kunye ne-Thermal Conductivity: Izinga lokunciphisa elifanelekileyo (22%-24% ngokupasa) ikhuthaza i {111} ukuthungwa ekuphenduleni >60% (conductivity thermal 12% phezulu kunokwakheka okungahleliwe). Okuchasene, amazinga okunciphisa angaqhelekanga (>30%) ukwandisa i {100} Ubungakanani bokwakheka kwe 18%, ukunciphisa ukuhanjiswa kwe-thermal nge-5%-ukungaphumeleli ukuhlangabezana neemfuno ezichanekileyo zokutshatyalaliswa kobushushu bezixhobo ze-VR / AR.

(2) Ubungakanani beModeli yoLwakhiwo lweeNkozo kunye nokuQhutywa kweThermal: Ukujongana neNgcaciso yeeSinki zobushushu eziNcinci

Ngenxa yobukhulu obuncinci kunye nokuxinana kobushushu obuphezulu (10-20W/cm²) ye-VR/AR iitanki zobushushu ezincinci, unxulumano oluchanekileyo ngakumbi lwenkozo-thermal conductivity luyafuneka. Ithathwe kwithiyori ye-metal conduction thermal conduction, ifomula yi:

λ = λ₀ × [1 – k×(6/d)]

• λ₀: I-Thermal conductivity ye-aluminium enye-crystal (237W /(m · k) ku 25℃);

• k: I-coefficient yokusasazwa komda wokuziinkozo (0.12 kolu hlobo lwefoyile yealuminiyam);

• d: Ubungakanani beenkozo (μm; i-micro heat sinks ifuna i-d=5-7μm ngokutenxa okusemgangathweni ≤2μm).

Xa i-d inyuka ukusuka kwi-5μm ukuya kwi-15μm, λ inyuka ukusuka kwi-225W/(m · k) ukuya ku-232W/(m · k), umahluko we 7W/(m · k). Kwiizinki zobushushu ezincinci, lo mahluko ubangela umahluko wobushushu bendawo obudlula i-4℃-kude ngaphaya komda we-≤3℃ wezixhobo zeVR/AR-okukhokelela ekupheliseni ubushushu kwiindawo ezifileyo..

3. Iimeko eziNtathu zoLwakhiwo lweeNkozo ezingaLinganiyo eziBangwe luLawulo lweRhafu olungafanelekanga (Ilungelelaniswe kwi-VR/AR yeeMfuno zoKuchitha ubushushu)

Ukulinganisa impembelelo yolawulo olungafanelekanga lokunciphisa izinga lokufana kweenkozo kunye nokutshatyalaliswa kobushushu, Itafile 1 ishwankathela iiparameters eziphambili zemeko yokusilela ngakunye, inxulumanisa ngqo iziphene zenkqubo kwimiba yokusebenza kwesixhobo:

Itafile 1: Ulwakhiwo lweenkozo kunye neeParameters zokuLahlwa koBubushushu phantsi kweemeko ezingafanelekanga zokuNcitshiswa kweRayithi

(1) Ireyithi yokuNcitshiswa iyonke enganelanga (<50% kwiiPasi eziBalulekileyo): Ukungonelanga kweRecrystallization kunye nokuFudunyiswa kweNdawo yeeSinki zobushushu

1. Iimpawu zeNkqubo: Kuba ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR, ireyithi yokunciphisa iyonke kwi 3 idlula ngaphambi kokugqiba ukuqengqeleka (ubukhulu ukusuka 50μm→25μm→12μm) kufuneka ibe ≥50%. Ukuba kuncitshiswe ku 40% (50μm→30μm), amandla agciniweyo ehla ukuya ku-65J/m³—ngaphantsi kwexabiso elibalulekileyo le-DRX;

2. Impembelelo kuLwakhiwo lweeNkozo kunye nokuNcitshiswa koBubushushu: Njengoko kubonisiwe kwiThebhile 1, le meko yenza usasazo lweenkozo ezimbini. Umahluko ohambelanayo λ kwisinki yobushushu encinci ifikelela kwi-8W/(m · k), ekhokelela kumahluko we-10 ℃ kwiqondo lokushisa lasekhaya kwi-VR / AR i-headset chips kunye nokubangela ukwehla kwesakhelo-echaphazela ngokuthe ngqo amava omsebenzisi..

(2) Ukuguquguquka Okugqithisileyo kwireyithi yokuNcitshiswa kwePasi enye (Ukutenxa >8%): IiNdawo ezifileyo zoTyalo lweNkozo kunye noTyalo loBubushushu

1. Iimpawu zeNkqubo: Umyinge wokucuthwa kokupasa omnye kwi 2 idlula phambi kokuqengqeleka kokugqibela (25μm→12μm→6.35μm) kufuneka uzinze e 45%-50%. Ukunxiba kweerola kunokubangela ukuguquguquka 38%-48% (10% ukutenxa);

2. Impembelelo kuLwakhiwo lweeNkozo kunye nokuNcitshiswa koBubushushu: Ngokukodwa, oku kuguquguquka kudala ukutshintshiselana “imicu ebandayo/eshushu” ecaleni kwendlela yokuqengqeleka. NjengeTheyibhile 1 ibonisa, Umahluko we-thermal conductivity ufikelela kwi-8W/(m · k), kwaye umahluko weqondo lobushushu udlula i-10℃-kude ngaphaya komda wesixhobo seVR/AR-ukwenza iindawo ezifileyo zokuchitha ubushushu obungenakuguqulwa..

(3) Ireyithi yoNciphiso engalinganiyo eNxweme (Ukutenxa kuMda-ombindi >5%): I-Edge Overheating kunye nokuNcitshiswa kweDivayisi eNcitshiswayo

1. Iimpawu zeNkqubo: Isithsaba sokuqengqeleka esingaqhelekanga (0.02mm→0.04mm) oonobangela a 6% ukutenxa kwizinga lokunciphisa elinqamlezileyo (48% kwiziko, 42% emiphethweni);

2. Impembelelo kuLwakhiwo lweeNkozo kunye nokuNcitshiswa koBubushushu: Ngaphaya kwezi meko zingasentla, ukungalingani okunqamlezileyo kuchaphazela ikakhulu ukuqina kwesixhobo. Itafile 1 ibonisa ubushushu emphethweni yi 7℃ ngaphezulu kunombindi, Ukukhawulezisa ukuguga kwerabha yokutywina kunye nokunyusa izinga lokusilela ukusuka 1.5% ukuya kwi-4.8%-umqhubi weendleko ezinkulu kubavelisi.

4. Ukuqinisekiswa kwe-VR/AR yeSixhobo sokuFayiswa koKuchithwa koBubushushu okuBangwe kuLwakhiwo lweeNkozo ezingalinganiyo

Ukwakha kuhlalutyo lwemeko, zombini uvavanyo lwaselabhoratri kunye nophononongo lwemeko yoshishino lwenziwa ukuqinisekisa impembelelo ebonakalayo yokungalingani okuziinkozo. Itafile 2 inikezela ngedatha yoqinisekiso lwelabhoratri eneenkcukacha, ngelixa iimeko zehlabathi lokwenyani ziqinisekisa ngakumbi iziphumo.

Itafile 2: Iziphumo zoQinisekiso lweLabhoratri yeMicro Heat Sink Performance

(1) Ukuqinisekiswa kweLabhoratri (Ukutshatisa iMicro Heat Sink Scenarios)

1. Ukulungiselela Isampulu: Khetha ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR nge “aguquguqukayo amazinga okucutha ipasi enye” (indawo yengqolowa ecolekileyo d=5μm, ummandla weenkozo ezirhabaxa d=14μm) kwaye wenze i-10mm×5mm×6.35μm iitanki zobushushu ezincinci;

2. Uvavanyo: NjengeTheyibhile 2 imiboniso, kusetyenziswa ubushushu obuyi-15W/cm² (simulating VR chip ukuvelisa ubushushu) ibonakalise i-11℃ umahluko wobushushu-ugqithise kakhulu imfuneko ≤3℃. Uhlalutyo lwe-Laser flash (NETZSCH LFA 467) iqinisekise umahluko we-thermal conductivity ye-8W/(m · k);

3. Ukuqukumbela: Iindawo zokulahla ubushushu ezifileyo ezibangelwa kukungalingani kwesakhiwo senkozo tyhala amaqondo obushushu etshiphu yesixhobo seVR ngaphezu komda. (60℃), ukuvuselela ukhuseleko lokunciphisa amaza.

(2) Ityala loShishino: Uhlalutyo lokungaphumeleli koMvelisi weSixhobo seVR

Ngaphakathi 2023, umenzi we-headset we-VR osetyenzisiweyo ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR nge “amazinga okunciphisa anqamlezayo angalinganiyo,” ikhokhelela kwi:

• Njengoko kubonisiwe kwiThebhile 2, ubushushu bomda wesitya sobushushu bufikelele kuma-58℃ (vs. 51℃ embindini), ebangela ukuncipha rhoqo kwe-chip (isantya sesakhelo sihla ukusuka kwi-90Hz ukuya kwi-75Hz);

• Izinga lesikhalazo somthengi linyuka ukusuka 2.3% ukuya 8.5%, ngexabiso elinye emva kwentengiso egqithileyo 5 isigidi yuan;

• Emva kokutshintsha i-foil ngamazinga okunciphisa aphuculweyo (njengoko kubonisiwe kumqolo wesithathu weThebhile 2), Umahluko weqondo lobushushu lokutshatyalaliswa kwehle ukuya kwi-2.5℃, kwaye izinga lesikhalazo labuyela ku 1.2%.

5. UbuCwangciso bokuNcitshiswa kweRhafu yokuNcitshiswa kwe-Aluminiyam kwi-VR / AR I-Micro Heat Sinks

Ngokusekwe kwiziphumo zokuqinisekisa, izicwangciso zolawulo ekujoliswe kuzo zaphuhliswa ukujongana nemeko yokusilela. Undoqo ulele kuyilo lwenqanaba lokucutha izinga, ulawulo lokupasa olunye oluzinzileyo, kunye nokusabalalisa okunqamlezileyo okufanayo-kunye neeparitha eziphambili ezichazwe kwiThebhile 3.

Itafile 3: Uyilo lwenqanaba lokuNcitshiswa kwenqanaba le-6.35μm 1235 Ifoyile yeAluminiyam (Ubutyebe bokuqala 2mm)

(1) Uyilo lweRayithi yokuNcitshiswa kweStage iyonke: Ukuziqhelanisa neeMfuno eziziinkozo zeMicro Heat Dissipation

NjengeTheyibhile 3 ibonisa, inqanaba lokugqiba (uyapasa 7-8) kubaluleke kakhulu-ukugcina izinga lokunciphisa lilonke ≥50% iqinisekisa ukuguqulwa kwamandla agciniweyo afikelela kwi-90-110J/m³. Oku kubangela i-DRX eyaneleyo, okubangela ubungakanani beenkozo ze-5-7μm kunye nokutenxa okusemgangathweni ≤2μm-ehambelana ngokugqibeleleyo neemfuno ze-thermal conductivity ze-VR / AR i-micro heat sinks.

(2) Ulawulo lweReyithi yokuNcitshiswa kweSingle-Pass eZinzile: Ukucinezela i-VR / AR Ukutshatyalaliswa kobushushu kwiiNdawo ezifileyo

1. Roller Monitoring: Sebenzisa i-laser profilemeter ukuze ufumane ukunxiba kwexesha lokwenyani (ukuchaneka 0.001mm). Zitshintshe ngokuzenzekelayo iirola xa ukunxiba kudlula i-0.02mm, ukunciphisa ukuguquguquka ukusuka ± 8% ukuya ± 3% -inyathelo eliphambili lokuphepha “iinkozo ezicolekileyo/ezirhabaxa” igradient kwiTheyibhile 1;

2. ULungelelaniso lweTension: Gcina ugcino oluzinzileyo lokuqengqeleka koxinzelelo kwi-15-18kN (ukuguquguquka ≤±1kN). Buyekeza ukutenxa ngokulungisa isantya sokuqengqeleka (100-120m / yam), ukunciphisa ukuguquguquka kwepasi enye ukuya ≤5%;

3. Ingxelo ekwi-Intanethi: Sebenzisa igeyiji yobukhulu beX-reyi (ukuchaneka 0.1μm) ukuqokelela idatha rhoqo nge-10ms. Lungisa uxinzelelo lwe-cylinder yokunciphisa (ukuchaneka 0.01MPa) xa ukutenxa kobukhulu bungaphezu kwe-0.3μm-ukuqinisekisa ukuhambelana kwamazinga okupasa enye kwiThebhile 3.

(3) Ireyithi yokuNcitshiswa okufanayo: Ukuthintela Ukushisa Okugqithisileyo

1. CVC Roller Crown: Lungisa isithsaba kwi-0.015-0.02mm ngokusekelwe kububanzi bobushushu bokushisa (3-15mm), ukunciphisa ukutenxa koxinzelelo olunqamlezayo ukuya ku-≤3%-ukujongana nomba osembindini kwiThebhile 1;

2. Ukufudumeza komphetho: Faka isixhobo sokufudumeza edge (50-60℃) kwindawo yokusila yokusila ukunciphisa ukuxhathisa kwe-deformation, ukutenxa kumda wombindi >5% ukuya ≤3%;

3. Ukujongwa kweenkozo: Dibanisa inkqubo ye-intanethi ye-EBSD ukuqokelela idatha yengqolowa evela 3 amacandelo anqamlezayo ngemitha yefoyile. Lungisa isithsaba serola xa umahluko wesayizi yeenkozo udlula i-15%-ukuqinisekisa ukufana okunqamlezayo okuboniswe kwisampulu ephuculweyo yeThebhile. 2.

6. Izigqibo kunye ne-Outlook

Ulawulo olungafanelekanga lokunciphisa izinga ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR ibangela ukusabela kwetsheyini “amandla agciniweyo→ulwakhiwo lweenkozo→ukuhanjiswa kwe-thermal,” ukwenza iindawo ezifileyo zokuchitha ubushushu (ubushushu obuphezulu umahluko 11℃) kunye nokubeka esichengeni uzinzo lwesixhobo. Njengoko kubonisiwe kwiiThebhile 1-3, ukuphumeza “Ireyithi yokunciphisa igqibezela lilonke ≥50%, ukuguquguquka kwepasi enye ≤±5%, ukutenxa ngokunqamlezayo ≤3%” ifezekisa ubungakanani beenkozo ze-5-7μm (ukutenxa umgangatho ≤2μm) kunye nokwahlukana kwe-thermal conductivity ≤3W/(m · k)-ukuhlangabezana ≤3℃ imfuneko yokulahla ubushushu kwizixhobo zeVR/AR.

Izalathiso zophuhliso lwexesha elizayo zijolise kwimimandla emibini: ① Phuhlisa i “Inkqubo yokuqikelela izinga lokunciphisa i-AI” ukulungisa intsingiselo yoxinaniso lwamandla lwesixhobo esiphezulu se-VR/AR (amandla chip afikelela 20W nge 2025), yenza ulungiso oluphambili lokutenxa; ② Hlanganisa i-pulse-current-assisted rolling ukuze unciphise ngakumbi umahluko wesayizi yeenkozo, ukuqhubela phambili olu hlobo lwefoyile yealuminiyam ukuya “imimandla efileyo yokuchitha ubushushu.”

Umgaqo ongundoqo: Ukulawula izinga lokuncitshiswa kwe ifoyile yealuminiyam yeesinki zobushushu ezincinci kwizixhobo zeVR/AR kufuneka ibeke phambili “ukufana okuziinkozo kuqhelaniswe nokutshatyalaliswa kobushushu obuncinci.” Kuphela xa iiparamitha zihambelana ngokuchanekileyo neemfuno zokutshatyalaliswa kobushushu zesixhobo-njengoko kuboniswe kwidatha evela kwiiThebhile 1-3-ukusebenza okuthembekileyo kwexesha elide lezixhobo ze-VR / AR ziqinisekisiwe..